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Microelectronics failure an...

Microelectronics failure analysis [desk reference

Ross, Richard J.

ASM International c2011

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Libros electrónicos.

Monografía

monografia Rebiun17114312 https://catalogo.rebiun.org/rebiun/record/Rebiun17114312 m u cr cn||||||||| 120128s2011 ohua sbf 001 0 eng d 161503725X 9781615037254 9781615037261 (e-book) UCA DAW20856913 UPCT u290980 CaPaEBR. CaPaEBR. BUC Microelectronics failure analysis recurso electrónico] desk reference edited by Richard J. Ross 6th ed Materials Park, Ohio ASM International c2011 Materials Park, Ohio Materials Park, Ohio ASM International xi, 660 p. ill xi, 660 p. E-Libro Includes bibliographical references and indexes section 1. Introduction -- section 2. Failure analysis process overviews -- section 3. Failure analysis topics -- section 4. Fault verification and classification -- section 5. Localization techniques -- section 6. Deprocessing and sample preparation -- section 7. Inspection -- section 8. Materials analysis -- section 9. Focused ion beam applications -- section 10. Management and reference information Electronic reproduction. Palo Alto, Calif. ebrary 2011 Electronics- Materials- Testing- Handbooks, manuals, etc Microelectronics- Materials- Testing- Handbooks, manuals, etc Microelectronics- Materials- Defects- Handbooks, manuals, etc Electronic apparatus and appliances- Testing- Handbooks, manuals, etc Semiconductors- Defects- Handbooks, manuals, etc Libros electrónicos. local Ross, Richard J. ebrary, Inc E-Libro (Servicio en línea)

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monografia Rebiun17114312 https://catalogo.rebiun.org/rebiun/record/Rebiun17114312 m u cr cn||||||||| 120128s2011 ohua sbf 001 0 eng d 161503725X 9781615037254 9781615037261 (e-book) UCA DAW20856913 UPCT u290980 CaPaEBR. CaPaEBR. BUC Microelectronics failure analysis recurso electrónico] desk reference edited by Richard J. Ross 6th ed Materials Park, Ohio ASM International c2011 Materials Park, Ohio Materials Park, Ohio ASM International xi, 660 p. ill xi, 660 p. E-Libro Includes bibliographical references and indexes section 1. Introduction -- section 2. Failure analysis process overviews -- section 3. Failure analysis topics -- section 4. Fault verification and classification -- section 5. Localization techniques -- section 6. Deprocessing and sample preparation -- section 7. Inspection -- section 8. Materials analysis -- section 9. Focused ion beam applications -- section 10. Management and reference information Electronic reproduction. Palo Alto, Calif. ebrary 2011 Electronics- Materials- Testing- Handbooks, manuals, etc Microelectronics- Materials- Testing- Handbooks, manuals, etc Microelectronics- Materials- Defects- Handbooks, manuals, etc Electronic apparatus and appliances- Testing- Handbooks, manuals, etc Semiconductors- Defects- Handbooks, manuals, etc Libros electrónicos. local Ross, Richard J. ebrary, Inc E-Libro (Servicio en línea)